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The microelectronic semiconductor industry, with its frequent
innovations, often presents challenges to the performance
of vapor scrubbing products and other environmental protection
equipment. Semiconductor tool exhaust can contain both
the process feed gases and newly formed gases or particulates.
Many of the newly formed gases are highly reactive and
will hydrolyze upon contact with water vapor forming solids
and acid gases. A very common example follows.
|C2F6 + SiO2 >>>> HF +
SiF4 + (CO, CO2, COF2)
|| In process
|SiF4 + H2O >>>> SiO2(s)
|| In Scrubber
MYSTAIRE?/SUP> scrubbers successfully remove corrosive
and hazardous vapors, fumes, particulates, and odors under
the most stringent requirements. Our systems utilize a
unique inlet chamber-the Nitrogen Shielded Inlet-to prevent
plugging at the system inlet-a common problem with other
wet scrubbers. In addition, our scrubbers have both venturis
and packed sections to ensure thorough, efficient removal
of both gases and particulates. You need both stages to
fully clean the gas stream. Systems are available for both
point-of-use (POU) and Central/House scrubbing applications.
Our Capabilities and Technologies ensure
successful Contaminant removal
in all Typical
- Free Process Evaluations
- Full System Integration
- In-house Engineering and Design
- In-house Assembly and Testing
- In-house Laboratory
- Turnkey Projects
- Full Commissioning Support
- ACAD in 3D
- PLC Controls
- P&ID, PFD Design
- Exotic Metals, FRP, Dual Laminates
- Skid Mounted Systems
- Class 1, Division 1, Group C
||One of the most popular
point-of-use (POU) scrubbers on the market. Compact,
rugged design makes it the perfect complement to
any R & D or low throughput wafer production
facility. N2 inlet shield prevents water backstreaming
to vacuum pump, keeps inlet clear.
||POU, multistage scrubber
designed for semiconductor full-scale production
facilities typically located as close to the process
tool as possible, often in the sub-fab or cleanroom
chase. Handles all water- soluble effluents from
the process tool.
||POU scrubber specifically
designed for the removal of gases from wafer cleaning
||Combination of two scrubbing
techniques. Eductor venturi section removes particulates,
quenches hot gas streams, performs preliminary
gas scrubbing and acts as a wet fan. The packed
column (PC) stage removes the balance of the gas
scrubbers often used in laboratories or other low-flow
applications where space is at a premium. Small
footprint makes them ideal for acid digestion procedures
and low flow reactor exhaust.
||Packed column scrubbers
intended for gas removal only. Most common type
in the industry. Also referred to as countercurrent
scrubbers since the gas and liquid flows are counter
to each other.
||Crossflow scrubbers recommended
for applications where the contaminants are gases
only. Excellent for applications with limited height.
MYSTAIRE?/SUP> Scrubbers will successfully
- --- and many more
- Process Tool Exhaust : CVD, Poly, Dielectric,
- Etch Applications : RIE, Deep Trench
- Burn Box Exhaust
- Wet Bench Exhaust
- House Scrubbing
- Chemical Vapor Exhaust
- Gas Cabinet Purges
- Wafer Cleaning Station Exhaust
- Emergency Release
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