WONCOSA Solder Spheres are offered in many Alloys and diameters for manufacture and repair of various packages require advance solder joint technology. Standard solder alloys for PBGA & CBGA are available. Custom composition like pure lead, tin, tin/gold 10/90 etc. can be available on request.
WONCOSA Solder Spheres are very small spheres fitting micro soldering system requirements. Phicom Solder Spheres can be used as conductor bumps on hybrid ICs, power transistors, solder miniature parts such as crystal resonators and diodes.