Phicom provides the JEDEC Thin Tray for your MQFP, TQFP, BGA, uBGA and CSP devices for inprocess, testing and the IC Shipping & handling.
Advantages to buy our WONCOSA Tray:
Over 100 Open Tools available for choice in CSP, BGA, TSSOP, MQFP, LQFP More Temperature Selection (range from 50 ¢XC to 180 ¢XC) Can offer Recycle Tray Program Low Tooling Cost for Custom Jedec Tray Can order in USA and drop ship in Asia Assembly House Competitive unit price and Stability in Quality
