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PRODUCT
INFORMATION
Snap
Cure In-line System
S-3000 Clean
Automatic Snap Cure
SYNCRITE
Clean Cure Oven Features:
- 8 kinds of the process data can be memorized.
- No leads nor islands contact on heat blocks during
being processed.
- Wide magazine shelves make you long no man operation.
- Tremendous reduction of the lead time can be
achieved.
- IC chips and lead frames are free from contamination.
- Copper lead frames can be processed without coloration
- Temperature profile is precisely controlled for
the reaction of silver epoxy paste.
- SECS communication
system is provided. (Option)
- Data setting
and logging are available by a personal computer. (Option)
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Clean
Nitrogen gas Down Flow
Specification
of SC-3000
Lead
Fram: |
Width 20-70mm
Length 20-250mm
Thickness 0.1-0.25mm
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Magazine
Size: |
Width 30-76mm
Length 125-260mm
Height 100-150mm
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Temperature Setting: |
Room Temperature
- 500 ?/SUP>C
(Guaranteed value: 400 ?/SUP>C)
Minimum setting temperature: 1 ?/SUP>C
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Indexing
Time: |
6.0?/SUP>99.9
sec
Minimum setting time: 0.1 sec
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Nitrogen supply: |
Max. 60 l/min
for non-flame torches
Max. 30 l/min for cool purging
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Utilities: |
Power AC200V /3
Phases /50,60Hz
Power consumption max 6KVa (2.5Kva at steady state)
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Dimension: |
Width 700mm
Height 1,300mm
Depth 1,200mm
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Lead
Frame Pass Line: |
Height 1,010mm
Depth 515mm
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Copyright 2004Phicom Asia-Pacific
Co.,Ltd. All rights reserved. |