For the destructive and non-destructive testing of die attach strength

• Apply horizontal shear force (0-100K gram) to the edge of a die
• Ease to use
• Automatic stop is provided at shear or stop at non-destructive limit
• Quick set up procedure for non-destructive testing

WIRE BOND PULL TESTER

For in-process monitoring of bond pull strength (destructive & non-destructive)

• Convenient manual unit
• User-friendly
• Ease to set up procedure

LEAD FATIGUE TESTER

For verify the lead integrity of semiconductor devices

• Countdown counter is used for non-destructive limit testing
• Suitable for various package types
• Different weights are available
• Tested at bend angles from 15^?/SUP>
• Speed control for constant test