|
Phicom provides the JEDEC Thin
Tray for your MQFP, TQFP,
BGA, uBGA and CSP devices for inprocess, testing and the IC Shipping
& handling.
Advantages
to buy our WONCOSA Tray:
- Over 100
Open Tools available for choice in CSP, BGA, TSSOP,
MQFP, LQFP
- More Temperature Selection (range from 50 °C
to 180 °C)
- Can offer Recycle Tray Program
- Low Tooling Cost for Custom Jedec Tray
- Can order in USA and drop ship in Asia Assembly
House
- Competitive unit price and Stability in Quality
|
