Decapsulation
needs highly skilled technique and auxiliary equipment because strong
acid chemicals are being used during the decapsulation process.
So the most QC divisions of companies for the semiconductor or electronic
industry have difficulty of decapsulation.
To get accurate analysis of the defective one, careful decapsulation
is required. That is, there should not be any damage of bond pads,
bone wires and lead frame when the opening process. However, even
for the expert, it can¡¯t be expected to decapsulate perfectly with
satisfaction of all above conditions.
Decaper2001 has been developed for the expert, unskilled engineers
and everybody who is qualified to decapsulate. It is an equipment,
which can remove EMC(Epoxy Molding Compound) completely using GUI(graphic
user interface).
And also the Decaper-2001 can verifies whether the defects come
from in the packaging process or the wafer process, when the examined
packaged chip is judged to have defects.
Such precise decapsulation analysis contributes greatly to improve
productivity, as it is an immediate feedback to the production line.
The
necessity of Defective analysis for the semiconductors in the manufacturing
process of semiconductors or other electrical raw materials has
highly increased as the devices are getting diverse and highly integrated.
